Features

 All bridges can be controlled independently.

An ultra-fine CMOS process has been adopted for low power

consumption in a design with no charge-pump.

 Built-in H bridge of a full-swing drive 4 circuit

 Built-in low-voltage malfunction prevention circuit

 Power supply systems are all internally isolated and include

a function to prevent reverse current between power supplies.

 It is housed in a small package (24SSOP 6.5x6.4 mm t=1.0mm)