Features

• Specifications per DLA VID V62/08608

• Full Mil-Temp Electrical Performance from -55°C to +125°C

• Controlled Baseline with One Wafer Fabrication Site and

One Assembly/Test Site

• Full Homogeneous Lot Processing in Wafer Fab

• No Combination of Wafer Fabrication Lots in Assembly

• Full Traceability Through Assembly and Test by

Date/Trace Code Assignment

• Enhanced Process Change Notification

• Enhanced Obsolescence Management

• Eliminates Need for Up-Screening a COTS Component

• Voltage Feedforward Mode

• Step Down DC/DC Supporting up to 2A Based on Max TJ

and VIN/VOUT

• Input Voltage Range of 9.0V to 60V

• Internal Reference of 1.21V ±1

• Adjustable Output Voltage Range of 1.21V to 55V

• Adjustable Switching Frequency 100kHz to 600kHz

• Frequency SYNC Pin

• Zero Load Current Operation

• Pulse by Pulse Mode Current Limit and Hiccup mode

• Low Standby Current of 60μA Typical

• Thermal Shut-down

• Load Dump to 100V for 400ms

Applications

• Industrial and Avionics power supplies

• Portable computers

• Battery chargers

• Distributed power systems

Related Literature

• Technical Brief TB363 “Guidelines for Handling and

Processing Moisture Sensitive Surface Mount Devices

(SMDs)”