Features

• Specifications per DLA VID V62/10602

• Full mil-temp electrical performance from -55°C to +125°C

• Controlled baseline with one wafer fabrication site and one

assembly/test site

• Full homogeneous lot processing in wafer fab

• No combination of wafer fabrication lots in assembly

• Full traceability through assembly and test by date/trace

code assignment

• Enhanced process change notification

• Enhanced obsolescence management

• Eliminates need for up-screening a COTS component

• High ESD protection on RS-485 outputs ±16.5kV HBM

- IEC61000-4-2 contact test method . . . . . . . . . . . . . . . ±7kV

- Class 3 ESD level on all other pins. . . . . . . . . . . .>8kV HBM

• Specified for +125°C operation (VCC ≤ 3.6V only)

• Logic supply pin (VL) eases operation in mixed supply

systems

• Hot plug - Tx output remains tri-state during power-up

• Low Tx leakage allows >256 devices on the Bus

• High data rates. . . . . . . . . . . . . . . . . . . . . . . . . . up to 16Mbps

• Low quiescent supply current. . . . . . . . . . . . . . . 150µA (Max)

- Very low shutdown supply current . . . . . . . . . . . 1µA (Max)

• -7V to +12V Common Mode Output Voltage Range

(VCC ≤ 3.6V Only)

• Current limiting and thermal shutdown for driver overload

protection (VCC ≤ 3.6V Only)

• Tri-statable Tx output

• 5V tolerant logic input when VCC ≤5V