Features/Benefits

• 20-pin TSSOP package; small board footprint

• Spread-spectrum capable; reduces EMI

• Outputs can be terminated to LVDS; can drive a wider

variety of devices

• Power down pin; greater system power management

• OE control pin; greater system power management

• Spread and frequency pin selection; no software

required to configure device

• Industrial temperature range available; supports

demanding embedded applications

• For PCIe Gen3 applications, see the 5V41236