Features

▪ Single 1.7 V - 2.0 V Supply

▪ 64-Mbit Flash Memory

▪ Serial Peripheral Interface (SPI) and Quad Peripheral Interface (QPI) Compatible

• Supports SPI Modes 0 and 3

• Supports Dual Output Read and Quad I/O Program and Read

• Supports QPI Program and Read

• 133 MHz Maximum Operating Frequency

• Clock-to-Output (tV1) of 6 ns

• Up to 66 MB/s Continuous Data Transfer Rate

▪ Full Chip Erase

▪ Flexible, Optimized Erase Architecture for Code and Data Storage Applications

• 0.6 ms Typical Page Program (256 Bytes) Time

• 60 ms Typical 4-kByte Block Erase Time

• 200 ms Typical 32-kByte Block Erase Time

• 350 ms Typical 64-kByte Block Erase Time

▪ Hardware Controlled Locking of Status Registers via WP Pin

▪ 4 kbit Secured One-Time Programmable Security Register

▪ Hardware Write Protection

▪ Serial Flash Discoverable Parameters (SFDP) Register

▪ Flexible Programming

• Byte/Page Program (1 to 256 Bytes)

• Dual or Quad Input Byte/Page Program (1 to 256 Bytes)

▪ Erase/Program Suspend and Resume

▪ JEDEC Standard Manufacturer and Device ID Read Methodology

▪ Low Power Dissipation

• 2 µA Deep Power-Down Current (Typical)

• 10 µA Standby current (Typical)

• 5 mA Active Read Current (Typical)

▪ Endurance: 100,000 program/erase cycles (4 kB, 32 kB or 64 kB blocks)

▪ Data Retention: 20 Years

▪ Industrial Temperature Range: -40°C to +85°C

▪ Industry Standard Green (Pb/Halide-free/RoHS Compliant) Package Options

• 8-pad DFN (6 x 5 x 0.6 mm)

• 8-ball WLCSP (dBGA)

• Die in Wafer Form