Features

▪ 32-Mbit Flash Memory

▪ Serial Peripheral Interface (SPI) Compatible

• Supports SPI modes 0 and 3

• Supports single input/output operations (1,1,1)

• Supports dual input and dual output operations (1-1-2), (1-2-2), (0-2-2)

• Supports quad input and quad output operations (1-1-4), (1-4-4), (0-4-4)

▪ Continuous Read mode (with 8/16/32/64 bytes wrap) - optimized for XiP

▪ 108 MHz Maximum Operating Frequency

▪ Single 2.7 V - 3.6 V Single Supply Voltage

▪ Serial Flash Discoverable Parameters (SFDP, JESD216B) support

▪ OTP Memory

• Three Protected Programmable Security Register Pages (Page size: 256 bytes)

• 64-bit factory programmable UID register

▪ Hardware Write Protection (WP pin)

▪ Software Write protection (Programmable non-volatile control registers)

▪ Program and Erase Suspend and Resume

▪ Byte programming size: up to 256 bytes

▪ Erase Size and Duration

• Uniform 4-kbyte Block Erase (55 ms typical)

• Uniform 32-kbyte Block Erase (120 ms typical)

• Uniform 64-kbyte Block Erase (200 ms typical)

• Full Chip Erase (10 seconds typical)

▪ Low Power Dissipation

• Standby Current (13 µA typical)

• Deep Power Down Current (1 µA typical)

▪ Endurance: 100,000 Program and Erase Cycles

▪ Data Retention: 20 Years

▪ Industrial Temperature Range (-40 oC to 85 oC)

▪ Industry Standard Green (Pb/Halide-free/RoHS Compliant) Package Options

• 8-lead SOIC (0.150” Narrow and 0.208” Wide)

• 8-pad Ultra-Thin DFN (5 x 6 x 0.6 mm)

• Die Wafer Form

• Other Package Options (contact Renesas Electronics)