Features

 Single 2.7 V - 3.6 V Supply

 Serial Peripheral Interface (SPI) and Quad Peripheral Interface (QPI) Compatible

 Supports SPI Modes 0 and 3

 Supports Dual Output Read and Quad I/O Program and Read

 Supports QPI Program and Read

 104 MHz Maximum Operating Frequency

 Clock-to-Output (tV1) of 6 ns

 Up to 52 MB/s continuous data transfer rate

 Quad SPI Enabled (factory default setting, see Section 6.7)

 Full Chip Erase

 Flexible, Optimized Erase Architecture for Code and Data Storage Applications

 0.6 ms Typical Page Program (256 Bytes) Time

 60 ms Typical 4-Kbyte Block Erase Time

 350 ms Typical 32-Kbyte Block Erase Time

 700 ms Typical 64-Kbyte Block Erase Time

 Hardware Controlled Locking of Protected Blocks via WP Pin

 4 kbit secured One-Time Programmable Security Register

 Software and Hardware Write Protection

 Serial Flash Discoverable Parameters (SFDP) Register

 Flexible Programming

 Byte/Page Program (1 to 256 Bytes)

 Dual or Quad Input Byte/Page Program (1 to 256 Bytes)

 Erase/Program Suspend and Resume

 JEDEC Standard Manufacturer and Device ID Read Methodology

 Low Power Dissipation

 2 µA Deep Power-Down Current (Typical)

 10 µA Standby current (Typical)

 Endurance: 100,000 program/erase cycles (4 kB, 32 kB or 64 kB blocks)

 Data Retention: 20 Years

 Industrial Temperature Range: -40°C to +85°C

 Industry Standard Green (Pb/Halide-free/RoHS Compliant) Package Options

 8-lead SOIC (208-mil)

 Die in Wafer Form