Miniature Power PCB RYII & RYII Reflow Solderable

Miniature Power PCB RYII & RYII Reflow Solderable ■ 1 pole 8A, 1 form C (CO) or 1 form A (NO) or 1 form B (NC) contact ■ Low component height 12.3mm ■ 5kV/8mm coil-contact ■ Reinforced insulation (protection class II) ■ Pinnings: 3.2mm and 5mm ■ Reflow-solderable version ■ Especially suit

Miniature Power PCB RYII & RYII Reflow Solderable

文件：411.5 Kbytes Page：4 Pages

Miniature Power PCB RYII & RYII Reflow Solderable

文件：411.34 Kbytes Page：4 Pages

Miniature Power PCB RYII & RYII Reflow Solderable

Miniature Power PCB RYII & RYII Reflow Solderable ■ 1 pole 8A, 1 form C (CO) or 1 form A (NO) or 1 form B (NC) contact ■ Low component height 12.3mm ■ 5kV/8mm coil-contact ■ Reinforced insulation (protection class II) ■ Pinnings: 3.2mm and 5mm ■ Reflow-solderable version ■ Especially suit

Miniature Power PCB RYII & RYII Reflow Solderable

文件：411.5 Kbytes Page：4 Pages

Miniature Power PCB RYII & RYII Reflow Solderable

文件：411.34 Kbytes Page：4 Pages

Miniature Power PCB RY II & RY II reflow-solderable

文件：279.34 Kbytes Page：4 Pages

CMOS 1M (64K x 16) MROM

DESCRIPTION The LH531024 is a mask-programmable ROM organized as 65,536 × 16 bits. It is fabricated using silicon-gate CMOS process technology. FEATURES • 65,536 words × 16 bit organization • Access time: 100 ns (MAX.) • Power consumption: Operating: 412.5 mW (MAX.) Standby: 550 µW