封装/外壳：8-SOIC（0.154"，3.90mm 宽）裸露焊盘 功能：降压 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：IC REG BUCK ADJUSTABLE 5A 8SOP 集成电路（IC） 稳压器 - DC-DC 开关稳压器

封装/外壳：8-SOIC（0.154"，3.90mm 宽）裸露焊盘 功能：降压 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：IC REG BUCK ADJUSTABLE 5A 8SOP 集成电路（IC） DC DC 开关稳压器

T-1 Subminiature Lamps

T-1 Subminiature Lamps T-1 Subminiature Short Type Lamps

1.880 to 1.930 GHz Small-Cell Power Amplifier Module

Features  InGaP HBT technology  –47 dBc ACPR @ ±10 MHz, +27 dBm  31 dB gain  High efficiency  Low transistor junction temperature  Matched for a 50 Ω system  Low profile miniature surface-mount package; RoHS compliant  Multi-carrier capability  Surface-mount (14-pin, 7  7  1.3

T-1 Sub-Midget Flange Base

T-1 Sub-Midget Flange Base & T-1 Bi-Pin Base (.050)

2.36mm (.093) Diameter, Standard .093 Pin and Socket Crimp Terminal, Series 7239, Male, with Tin (Sn) Plated Brass Contact, High Current, 14-18 AWG, Reel Packaged

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Sub-Midget Flange Base

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