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QC7A12.0000F08A01AR中文资料
QC7A12.0000F08A01AR数据手册规格书PDF详情
Features
• Low in height, suitable for thin equipment
• Ceramic package and metal lid assures high
reliability
• Tight tolerance and stability available
Applications
• High density applications
• Modem, communication and test equipment
• PMCIA, wireless applications
• Automotive applications
QC7A12.0000F08A01AR 资料下载更多...
QC7A12.0000F08A01AR 芯片相关型号
- 4272
- 47217-000LF
- 5686
- FZ1800R45HL4S7BPSA1
- LM4132CQ1MFR2.5
- LM4132CQ1MFR2.5.A
- LM4132CQ1MFR3.0
- LM4132CQ1MFR3.0.A
- LM4132CQ1MFR3.3
- LM4132CQ1MFT2.5
- LM4132CQ1MFT2.5.A
- LM4132CQ1MFT3.3
- LM4132CQ1MFT3.3.A
- MP25-A0H21E1-H3
- MP25-A0H21E1-J0
- MP25-A0H21E1-J3
- MP25-A0H21E1-P0
- P4KE56A
- PV6F2P0SSG201
- PV6F2P0SSG221
- PV6F2P0SSG231
- PV6F2PX11G2F1
- QC7A
- QC7A12.0000F08A00AM
- QC7A12.0000F08A00AR
- QC7A12.0000F08A01AM
- QC7A12.0000F08A02AM
- QC7A12.0000F08A02AR
- QC7A12.0000F08A03AM
- WM-BAX-CYW65
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