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QC5A12.0000F12B02AR中文资料
QC5A12.0000F12B02AR数据手册规格书PDF详情
Features
• Low in height, suitable for thin equipment
• Ceramic package and metal lid assures high
reliability
• Tight tolerance and stability available
Applications
• High density applications
• Modem, communication and test equipment
• PMCIA, wireless applications
• Automotive applications
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QC5A12.0000F12B02AR 芯片相关型号
- MSP430F1122IPW
- MSP430F1132IPW
- PIMXRT1179DVP2A
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- QC5A12.0000F12B10AM
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- QC5A12.0000F12B13AM
- QC5A12.0000F12B13AR
- QC5A12.0000F12B15AM
- QC5A12.0000F12B15AR
- SN74AHCT165
Datasheet数据表PDF页码索引
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