位置:QC3CA12.0000F12B15R3 > QC3CA12.0000F12B15R3详情
QC3CA12.0000F12B15R3中文资料
QC3CA12.0000F12B15R3数据手册规格书PDF详情
Features
• Ceramic epoxy sealed SMD package
• Low in height, suitable for thin equipment
• Tight tolerance and stability available
Applications
• High density applications
• Modem, communication and test equipment
更新时间:2025-12-5 15:53:00
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
INTEL/英特尔 |
23+ |
BGA |
3000 |
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、 |
|||
INTEL/英特尔 |
24+ |
BGA |
20000 |
只做正品原装现货 |
|||
INTEL |
2447 |
BGA |
100500 |
一级代理专营品牌!原装正品,优势现货,长期排单到货 |
|||
INTEL/英特尔 |
23+ |
BGA |
89630 |
当天发货全新原装现货 |
|||
INTEL/英特尔 |
24+ |
BGA |
21574 |
郑重承诺只做原装进口现货 |
|||
GRAYCHIP |
16+ |
BGA |
985 |
进口原装现货/价格优势! |
|||
QC |
36118 |
SOT23-5 |
2015 |
专业代理锂电充电管理IC,型号齐全,公司优势产品 |
|||
BUCHANAN |
24+ |
原装进口原厂原包接受订货 |
2500 |
原装现货假一罚十 |
|||
BUCHANAN |
2023+ |
SMD |
2500 |
安罗世纪电子只做原装正品货 |
|||
TE Connectivity |
2022+ |
1 |
全新原装 货期两周 |
QC3CA12.0000F12B15R3 资料下载更多...
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Datasheet数据表PDF页码索引
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