位置：QC3212.0000F12B22AR3 > QC3212.0000F12B22AR3详情
QC3212.0000F12B22AR3中文资料
QC3212.0000F12B22AR3数据手册规格书PDF详情
Features
• Low in height, suitable for thin equipment
• Ceramic package and metal lid assures high
reliability
• Tight tolerance and stability available
Applications
• High density applications
• Modem, communication and test equipment
• PMCIA, wireless applications
• Automotive applications
更新时间：2025-11-1 15:04:00
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
原厂 |
2023+ |
SMD |
50000 |
原装现货 |
|||
INTEL/英特尔 |
23+ |
BGA |
11200 |
原厂授权一级代理、全球订货优势渠道、可提供一站式BO |
|||
Deutsch |
24+ |
con |
2000 |
优势库存,原装正品 |
QC3212.0000F12B22AR3 资料下载更多...
QC3212.0000F12B22AR3 芯片相关型号
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- S25FL512SAGMFVQ13
- SN74AXCH8T245_V01
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