Bluetooth Low Energy 5.0 wireless MCU

Bluetooth Low Energy 5.0 wireless MCU

封装/外壳：40-VFQFN 裸露焊盘 包装：卷带（TR） 描述：QN9030T BLE SOC RF/IF，射频/中频和 RFID 射频收发器 IC

封装/外壳：40-VFQFN 裸露焊盘 包装：卷带（TR） 描述：QN9030T BLE SOC RF/IF，射频/中频和 RFID 射频收发器 IC

INSULATED PC SPACERS/SUPPORTS

INSULATED PC SPACERS / SUPPORTS • Board will be electrically insulated, eliminates need for insulating washers • Easy snap-in assembly • No tool required for installation • Designed for .062(1.57) thick boards • One piece design eliminates the need for additional screws and nuts • Slim desig

Military Managed 24 X 1G Copper Ports 1G F/O Port 5 X 10G Copper Ports

PRODUCT DESCRIPTION Driven by rapid advancement and lower costs, Ethernet is becoming the standard for IP-based components in a wide range of military and commercial applications, including: • Armored ground vehicles • Land autonomous vehicles (UGVs) • Robots • Mobile equipment fielded in h

Snap Rivets

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Snap Rivets

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Snap Rivets – continued

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