This is the much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained.

Features: • Compatible with automatic placement equipment. • RoHS compliant • Compatible with infrared and vapor phase reflow solder process. • Custom Bin available upon special request • View angel typ. 100° • 0.8mm Height Application: • Backlighting in dashboard and switch. • Telecommun