型号 功能描述 生产厂家 企业 LOGO 操作
QL3025

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

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QL3025

60,000 Usable PLD Gate pASIC3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

60,000 Usable PLD Gate pASIC3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

60,000 Usable PLD Gate pASIC3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

60,000 Usable PLD Gate pASIC3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

60,000 Usable PLD Gate pASIC3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

60,000 Usable PLD Gate pASIC3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

60,000 Usable PLD Gate pASIC3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

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25,000 usable PLD gate pASIC 3 FPGA combining high performance and high density.

QuickLogic

Inst, 2 Pr #181c #22 Str BC, PVC Ins E1, OS, Blk PVC Jkt, 300V PLTC ITC CMG

Product Description UL Instrumentation, 2 Pair 18+22AWG (7x26+7x30) Bare Copper, PVC Insulation E1 Color Code, Overall Beldfoil® Shield, Black PVC Outer Jacket, PLTC ITC CMG AWM 2464 SUN RES DIR BUR

BELDEN

百通

Premier Supplier of Electronic Hardware

文件:5.0379 Mbytes Page:60 Pages

ABBATRON

20mm COIN CELL HOLDERS

文件:516.659 Kbytes Page:1 Pages

KEYSTONE

Keystone Electronics Corp.

90 MHz Lowpass

文件:57.99 Kbytes Page:3 Pages

KR

KNOB

文件:78.39 Kbytes Page:1 Pages

ETCList of Unclassifed Manufacturers

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QL3025产品属性

  • 类型

    描述

  • 型号

    QL3025

  • 功能描述

    60,000 Usable PLD Gate pASIC3 FPGA Combining High Performance and High Density

更新时间:2025-11-20 23:00:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
QUKLOG
24+
NA/
4234
原厂直销,现货供应,账期支持!
OUICKLOGIC
23+
QFP208
20000
全新原装假一赔十
QUICKLOGIC
25+
QFP
996880
只做原装,欢迎来电资询
QUICKLOGIC
03+/05
QFP
3560
全新原装进口自己库存优势
QUICKLOGIC
25+
BGA
12496
QUICKLOGIC原装正品QL3025-3PB256I即刻询购立享优惠#长期有货
QUICKLOGIC
21+
QFP144
1709
QUICKLOG
25+
TQFP144
2568
原装优势!绝对公司现货
QUICKLOGIC
23+
QFP
98900
原厂原装正品现货!!
QUALCOMM
23+
QFP
2800
绝对全新原装!现货!特价!请放心订购!
QUICKLOGIC
23+
QFP
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、

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