Extremely low power premium tier Bluetooth Audio SoC in a BGA package, designed for use in compact, voice enabled, feature rich wire-free earbuds, hearables and headsets.

Extremely low power premium tier Bluetooth Audio SoC in a BGA package, designed for use in compact, voice enabled, feature rich wire-free earbuds, hearables and headsets.

THRU HOLE MOUNT TEST POINTS - COLOR KEYED

• Color keyed for visibility and quick identification • Economical choice for PC test point terminations • Snap-fit mounting provides positive retention for wave soldering • Wire form loop for safe, non-slip testing • Space saving, ultra low and low profile designs • High profile design for d

(THM) THRU HOLE MOUNT TEST POINTS - COLOR KEYED

• Color keyed for visibility and quick identification • Economical choice for PC test point terminations • Snap-fit mounting provides positive retention for wave soldering • Wire form loop for safe, non-slip testing • Space saving, ultra low and low profile designs • High profile design for d

(THM) THRU HOLE MOUNT TEST POINTS - COLOR KEYED

• Color keyed for visibility and quick identification • Economical choice for PC test point terminations • Snap-fit mounting provides positive retention for wave soldering • Wire form loop for safe, non-slip testing • Space saving, ultra low and low profile designs • High profile design for d

THM TEST POINTS

(THM)THRU HOLE MOUNT TEST POINTS-COLOR KEYED •Color keyed for visibility and quick identification •Economical choice for PC test point terminations •Snap-fit mounting provides positive retention for wave soldering •Wire form loop for safe, non-sliptesting •Space saving, ultra low

Connector Audio, Straight Cord, Male, 3&5 Conductor

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