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型号 功能描述 生产厂家 企业 LOGO 操作
QCC5125

Bluetooth

Low Power Bluetooth Audio SoC, designed for use in mainstream Bluetooth speakers, stereo headsets and truly wireless earbuds.\n\nQC5125 is a part of the QCC5100 Low Power Bluetooth Audio SoC Series. • Bluetooth\n• Voice Services\n• General Audio\n• CPU\n• DSP\n• Power Consumption\n• Package\n - Package Type: BGA\n - Pins: 90 pins\n - Pitch: 0.5mm Pitch\n - Package Size: 5.5 x 5.5 x 1 mm\nLicense Keys: Qualcomm® cVc™ noise suppression technology, Qualcomm® aptX™ audio technology, Qualcomm® A;

QUALCOMM

高通

Low power SoC designed for mainstream Bluetooth speakers, stereo headsets and earbuds.

Low Power Bluetooth Audio SoC, designed for use in mainstream Bluetooth speakers, stereo headsets and truly wireless earbuds.\n\nQC5125 is a part of the QCC5100 Low Power Bluetooth Audio SoC Series. • Low power design\n• Bluetooth 5.1 radio\n• 2Mbps Bluetooth low energy (LE) support\n• Ultra-small form factor\n• Powerful quad-core processor* architecture\n• Dual core 32-bit processor application subsystem\n• Single core Qualcomm® Kalimba™ DSP Audio subsystem\n• Embedded ROM + RAM and external Q;

QUALCOMM

高通

Fast Recovery Diode

FEATURES ● Double side cooling ● High surge capability ● Low recovery charge APPLICATIONS ● Freewheel Diode ● D.C. Motor Drives ● Welding ● High Frequency Rectification ● Power Supplies

DYNEX

1550 nm LASER DIODES

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1550 nm LASER DIODES

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ONPANEL LCD PANEL CONTROLLER

文件:1.50558 Mbytes Page:58 Pages

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LED Displays Numeric 7-segment

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更新时间:2026-5-18 18:03:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
QUALCOMM/高通
24+
BGA
79839
代理高通蓝牙芯片原装现货
QUALCOMM/高通
23+
vfbga
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、

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