Bluetooth

Extremely low power premium tier Bluetooth Audio SoC in a smaller BGA package, designed for compact, feature-rich wireless earbuds, headsets and hearables.

THRU HOLE MOUNT TEST POINTS - COLOR KEYED

• Color keyed for visibility and quick identification • Economical choice for PC test point terminations • Snap-fit mounting provides positive retention for wave soldering • Wire form loop for safe, non-slip testing • Space saving, ultra low and low profile designs • High profile design for d

THM TEST POINTS

(THM)THRU HOLE MOUNT TEST POINTS-COLOR KEYED •Color keyed for visibility and quick identification •Economical choice for PC test point terminations •Snap-fit mounting provides positive retention for wave soldering •Wire form loop for safe, non-sliptesting •Space saving, ultra low

DIP Clips for 8-14-16-20-24-40 Pin Clips And 8 Through 40 Pin DIP Removers

文件：38.33 Kbytes Page：2 Pages

Compact Intelligent Power Module Based Motor Evaluation Board with Interleaved Power Factor Correction

文件：2.70362 Mbytes Page：26 Pages

Compact Intelligent Power Module (IPM) Motor Control Development Kit (MDK) 1 kW

文件：2.79432 Mbytes Page：28 Pages