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型号 功能描述 生产厂家 企业 LOGO 操作
QCC3034

Entry-Level Flash Low-Power Bluetooth Audio SoC

Qualcomm® QCCC3034 is an entry-level flash programmable Bluetooth Audio SoC based on an extremely low power architecture which has been designed for use in Bluetooth Stereo Headsets and supports Qualcomm aptX™ and aptX HD. The QCC3034 is available in a VFBGA package and is designed to provide our cu Bluetooth\nBluetooth Version\n• Bluetooth 5.0\nBluetooth Technology\n• Bluetooth Low Energy sensor hub\n• Dual-mode Bluetooth\nBluetooth Speed\n• 2 Mbps\nVoice Services\nDigital Assistant Activation\n• Button press\nGeneral Audio\nAudio Technology\n• Qualcomm® Broadcast Audio technology\n• Qualcomm®;

QUALCOMM

高通

Entry-Level Flash Low-Power Bluetooth Audio SoC

Qualcomm® QCCC3034 is an entry-level flash programmable Bluetooth Audio SoC based on an extremely low power architecture which has been designed for use in Bluetooth Stereo Headsets and supports Qualcomm aptX™ and aptX HD. The QCC3034 is available in a VFBGA package and is designed to provide our cu • Same low-power performance as QCC5100 Series\n• Optimized for Bluetooth stereo headsets/ headphones or for Bluetooth sport headsets \n• Bluetooth 5 radio\n• 2 Mbps Bluetooth low energy support\n• Very small form factor\n• Powerful tri-core processor architecture• Dual core 32-bit processor applica;

QUALCOMM

高通

Phototransistor Detector

Description: The NTE3034A is designed for industrial processing and control applications such as light modula tors, shaft or position encoders, and end tape detectors. The NTE3034A is designed to be used with the NTE3029A infrared emitter in optical slotted coupler/interrupter applications.

NTE

SDH/SONET STM1/OC3 postamplifier

文件:143.7 Kbytes Page:28 Pages

PHILIPS

飞利浦

SDH/SONET STM1/OC3 postamplifier

文件:143.7 Kbytes Page:28 Pages

PHILIPS

飞利浦

SDH/SONET STM1/OC3 postamplifier

文件:143.7 Kbytes Page:28 Pages

PHILIPS

飞利浦

SDH/SONET STM1/OC3 postamplifier

文件:143.7 Kbytes Page:28 Pages

PHILIPS

飞利浦

更新时间:2026-5-21 12:40:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
QUALCOMM
23+
QFN68
7566
原厂原装
QUALCOMM
25+
BGA
9000
只做原装正品 有挂有货 假一赔十
QUALCOMM/高通
23+
BGA
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
Qualcomm(高通)
23+
NA
20094
正纳10年以上分销经验原装进口正品做服务做口碑有支持
QUALCOMM/高通
23+
NA
7825
原装正品!清仓处理!
QUALCOMM/高通
24+
BGA
79839
代理高通蓝牙芯片原装现货
QUALCOMM
2023+
BGA
8800
正品渠道现货 终端可提供BOM表配单。
Qualcomm(高通)
25+
封装
500000
源自原厂成本,高价回收工厂呆滞

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