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型号 功能描述 生产厂家 企业 LOGO 操作
QCC3004

Bluetooth Audio SoCs

The QCC3004 flexible System-on-Chip (SoC) support increased OEM customization and are engineered to offer a rich set of audio features which have not typically been associated with mid to low tier Bluetooth wireless audio devices.\n\nThe QCC3004 supports Bluetooth headset applications. Coupled with • Dual-mode Bluetooth 5 qualified radio\n• Variants designed to address both headsets/headphones and speaker applications\n• Low-power Qualcomm® Kalimba™ DSP with on-chip ROM and RAM, stereo codec, battery charger, switch mode and linear regulators and LED drivers in a singlechip solution\n• Customi;

QUALCOMM

高通

Thyratrons

Description Thyratrons are fast acting high voltage switches suitable for a variety of applications including radar, laser and scientific use. PerkinElmer’s thyratrons are constructed of ceramic and metal for strength and long life. Over 300 thyratron types are available from PerkinElmer. The t

PERKINELMER

Remote control transmitter

GENERAL DESCRIPTION The SAA3004 transmitter IC is designed for infrared remote control systems. It has a total of 448 commands which are divided into 7 sub-system groups with 64 commands each. The sub-system code may be selected by a press button, a slider switch or hard wired. The SAA3004 gene

PHILIPS

飞利浦

Remote control transmitter

GENERAL DESCRIPTION The SAA3004 transmitter IC is designed for infrared remote control systems. It has a total of 448 commands which are divided into 7 sub-system groups with 64 commands each. The sub-system code may be selected by a press button, a slider switch or hard wired. The SAA3004 gene

PHILIPS

飞利浦

Remote control transmitter

GENERAL DESCRIPTION The SAA3004 transmitter IC is designed for infrared remote control systems. It has a total of 448 commands which are divided into 7 sub-system groups with 64 commands each. The sub-system code may be selected by a press button, a slider switch or hard wired. The SAA3004 gene

PHILIPS

飞利浦

SDH/SONET data and clock recovery unit STM1/4 OC3/12

文件:276.32 Kbytes Page:24 Pages

PHILIPS

飞利浦

更新时间:2026-5-18 13:33:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
QUALCOMM/高通
25+
BGA
90000
全新原装现货
Qualicomm
24+
QFN
5000
十年沉淀唯有原装
QUALCOMM/高通
2402+
BGA68
8324
原装正品!实单价优!
Qualicomm
24+
QFN
8000
原厂原装,价格优势,欢迎洽谈!
Qualicomm
24+
QFN
5000
全新原装正品,现货销售
QUALCOMM/高通
23+
BGA
11200
原厂授权一级代理、全球订货优势渠道、可提供一站式BO
QUALCOMM/高通
25+
QFN
18000
原装正品,全新来谈
QUALCOMM/高通
23+
QFN
98900
原厂原装正品现货!!
ADI
23+
BGA
8000
只做原装现货
QUALCOMM/高通
23+
BGA
50000
全新原装正品现货,支持订货

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