DESCRIPTION

The PKFCxxC series encapsulated flip chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 requirements. These devices are ideally suited for handheld devices, PCMCIA and SMART cards. This series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 250 Watts per line for an 8/20µs waveform. In addition, the PKFCxxC series features superior clamping performance, low leakage current characteristics and a response time of less than a nanosecond. Their low inductance virtually eliminates overshoot voltage due to package inductance.

FEATURES

• Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV

• Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns

• Chip Scale Package 0.050” x 0.030”

• ESD Protection > 25 kilovolts

• Available in Voltages Ranging from 3.3V to 36V

• 250 Watts Peak Pulse Power per Line (tp = 8/20µs)

• Bidirectional Configuration & Monolithic Structure

• Protection for 1 Line

• RoHS Compliant

• REACH Compliant

APPLICATIONS

• Cellular Phones

• MCM Boards

• Wireless Communication Circuits

• IR LEDs

• SMART & PCMCIA Cards