DESCRIPTION

DO-214AC; SOD106 surface mountable package with glass passivated chip.

The well-defined void-free case is of a transfer-moulded thermo-setting plastic.

FEATURES

• Glass passivated

• High maximum operating temperature

• Low leakage current

• Excellent stability

• Guaranteed avalanche energy absorption capability

• UL 94V-O classified plastic package

• Shipped in 12 mm embossed tape.