Scope

This specification describes the electrical, physical and dimensional properties of unsawn and sawn wafers on FFC of I•CODE1 Label ICs on a Philips 6C15 IDFW process and is the base for delivery of tested I•CODE1 Label ICs.

General recommendations are given for storage, handling and processing of wafers as well as assembly of labels.

Basic Features

The I•CODE1 Label IC is a dedicated chip for intelligent label applications like logistics and retail (including EAS) as well as baggage and parcel identification in airline business and mail services.

The I•CODE system offers the possibility of operating labels simultaneously in the field of the reader antenna (Anticollision). It is designed for long range applications.

Whenever connected to a very simple and cheap type of antenna (as a result of the 13.56 MHz carrier frequency) made out of a few windings printed, winded, etched or punched coil the I•CODE1 Label IC can be operated without line of sight up to a distance of 1.5 m (gate width).