位置：BYV28-500 > BYV28-500详情
BYV28-500中文资料
BYV28-500数据手册规格书PDF详情
DESCRIPTION
Rugged glass SOD64 package, using a high temperature alloyed construction.
This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy absorption capability
• Available in ammo-pack
• Also available with preformed leads for easy insertion.
更新时间：2025-11-3 9:36:00
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
PHI |
17+ |
SOD64 |
12000 |
只做全新进口原装,现货库存 |
|||
PHI |
23+ |
SOD64 |
6500 |
全新原装假一赔十 |
|||
PHI |
09+ |
SOD64 |
64000 |
绝对全新原装强调只做全新原装现 |
|||
PH |
2019+ROHS |
SOD-64 |
66688 |
森美特高品质产品原装正品免费送样 |
|||
PH |
24+ |
NA |
21322 |
公司原厂原装现货假一罚十!特价出售!强势库存! |
|||
A/N |
24+ |
1750 |
|||||
VISHAY/威世 |
23+ |
SOD64 |
50000 |
全新原装正品现货,支持订货 |
|||
VISHAY/威世 |
24+ |
NA/ |
12250 |
原装现货,当天可交货,原型号开票 |
|||
VISHAY/威世 |
25+ |
SOD64 |
9000 |
原装正品,假一罚十! |
|||
BROADCOM |
24+ |
BGA |
6618 |
公司现货库存,支持实单 |
BYV28-500 资料下载更多...
BYV28-500 芯片相关型号
PHILIPS相关芯片制造商
Datasheet数据表PDF页码索引
- P1
- P2
- P3
- P4
- P5
- P6
- P7
- P8
- P9
- P10
- P11
- P12
- P13
- P14
- P15
- P16
- P17
- P18
- P19
- P20
- P21
- P22
- P23
- P24
- P25
- P26
- P27
- P28
- P29
- P30
- P31
- P32
- P33
- P34
- P35
- P36
- P37
- P38
- P39
- P40
- P41
- P42
- P43
- P44
- P45
- P46
- P47
- P48
- P49
- P50
- P51
- P52
- P53
- P54
- P55
- P56
- P57
- P58
- P59
- P60
- P61
- P62
- P63
- P64
- P65
- P66
- P67
- P68
- P69
- P70
- P71
- P72
- P73
- P74
- P75
- P76
- P77
- P78
- P79
- P80
- P81
- P82
- P83
- P84
- P85
- P86
- P87
- P88
- P89
- P90
- P91
- P92
- P93
- P94
- P95
- P96
- P97
- P98
- P99
- P100
- P101
- P102
- P103
- P104
- P105
- P106
