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BY614中文资料
BY614数据手册规格书PDF详情
DESCRIPTION
Miniature glass package, using a high temperature alloyed construction.
This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
The package is designed to be used in an insulating medium such as resin, oil or SF6 gas.
FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Soft-recovery switching characteristics
• Very compact construction.
APPLICATIONS
• Miniature high-voltage assemblies such as voltage multipliers.
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
PHI |
23+ |
原厂正规渠道 |
5000 |
专注配单,只做原装进口现货 |
|||
PHI |
2026+ |
SOD |
800 |
原装正品,假一罚十! |
|||
PHI |
24+ |
原装正品 |
2500 |
原装现货假一罚十 |
|||
PHI |
23+ |
DIP |
50000 |
全新原装正品现货,支持订货 |
|||
PHI |
24+ |
DIP |
60000 |
||||
PH |
24+ |
DIP |
6268 |
||||
BROADCOM |
24+ |
QFP-144 |
6618 |
公司现货库存,支持实单 |
|||
恩XP |
24+ |
SOD61AI |
5070 |
全新原装,价格优势,原厂原包 |
|||
xilinx |
22+ |
NULL |
6800 |
||||
xilinx |
25+ |
NULL |
6000 |
全新现货 |
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