位置：BY578 > BY578详情
BY578数据手册规格书PDF详情
DESCRIPTION
Rugged glass package, using a high temperature alloyed construction.
This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Also available with preformed leads for easy insertion
• Designed to withstand transients up to 1700 V.
APPLICATIONS
• For use in multi-sync monitor horizontal deflection circuits
更新时间：2026-1-30 16:30:00
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
EIC |
24+ |
100 |
|||||
恩XP |
24+ |
SMD |
5500 |
长期供应原装现货实单可谈 |
|||
恩XP |
NA |
5500 |
一级代理 原装正品假一罚十价格优势长期供货 |
||||
N/A |
23+ |
NA |
276 |
专做原装正品,假一罚百! |
|||
恩XP |
23+ |
TO-220F |
50000 |
全新原装正品现货,支持订货 |
|||
恩XP |
2022+ |
TO-220F-2 |
500 |
原厂代理 终端免费提供样品 |
|||
恩XP |
20+ |
TO-220F-2 |
500 |
现货很近!原厂很远!只做原装 |
|||
恩XP |
2026+ |
TO-220F |
500 |
原装正品,假一罚十! |
|||
BROADCOM |
24+ |
QFP |
17860 |
公司现货库存,支持实单 |
|||
恩XP |
24+ |
TO-200F |
5070 |
全新原装,价格优势,原厂原包 |
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