FEATURES

• For surface mounted applications in order to optimize board space

• Low profile package

• Easy pick and place

• Complete device submersible temperature of 260oC for 10 seconds in

solder bath

• Plastic package has Underwriters Laboratory Flammability

Classification 94V-O

• Glass passivated junction

• Lead free in compliance with EU RoHS 2011/65/EU directive

• Green molding compound as per IEC61249 Std. . (Halogen Free)