Features

 Ideal for automated placement

 Ultra low forward voltage drop, low power loss

 High efficiency operation

 Low thermal resistance

 Ultra thin profile package for space constrained utilization

 Easy pick and place package suitable for automated handling

 Lead free in compliance with EU RoHS 2011/65/EU directive

 Green molding compound as per IEC61249 Std. . (Halogen Free)

Mechanical Data

 Case: TO-277B package

 Terminals: solder plated, solderable per MIL-STD-750,Method 2026

 Weight: 0.0038 ounces, 0.1088 grams.

 Marking: Part number