Features

 Glass passivated chip junction

 Ideally suited for automatic assembly

 Save space on printed circuit boards

 Ultra thin profile package for space constrained utilization

 Lead free in compliance with EU RoHS 2.0

 Halogen-free according to IEC 61249 standard

Mechanical Data

 Case : M4 Package

 Terminals : Solderable per MIL-STD-750, Method 2026

 Approx. Weight : 0.29 grams

Application

 QC/PD Charger

 General Console power

 NB Adapter

 Monitor Power

 Smart Speaker Power

 Slim Adapter