Features

 RDS(ON), VGS@10V, ID@20A<25mΩ

 RDS(ON), VGS@4.5V, ID@15A<28.5mΩ

 Advanced Trench Process Technology

 High density cell design for ultra low on-resistance

 AEC-Q101 qualified

 Lead free in compliance with EU RoHS 2.0

 Green molding compound as per IEC 61249 Standard

Mechanical Data

 Case : DFN5060-8L Package

 Terminals : Solderable per MIL-STD-750, Method 2026

 Approx. Weight : 0.0028 ounces, 0.08 grams