Features

 RDS(ON), VGS@10V, ID@10A<4.2mΩ

 RDS(ON), VGS@4.5V, ID@5A<6mΩ

 High switching speed

 Improved dv/dt capability

 Low Gate Charge

 Low reverse transfer capacitance

 Lead free in compliance with EU RoHS 2.0

 Green molding compound as per IEC 61249 standard

Mechanical Data

 Case: SOP-8 package

 Terminals: Solderable per MIL-STD-750, Method 2026

 Approx. Weight: 0.0029 ounces, 0.083 grams