Features

 RDS(ON), VGS@10V, ID@500mA<1.6Ω

 RDS(ON), VGS@4.5V, ID@200mA<2.5Ω

 RDS(ON), VGS@2.5V, ID@100mA<4.5Ω

 Advanced Trench Process Technology

 Specially Designed for Battery Operated Systems, Solid-State Relays Drivers: Relay, Displays, Memories, etc

 ESD Protected 2KV HBM

 AEC-Q101 qualified

 Lead free in compliance with EU RoHS 2.0

 Green molding compound as per IEC 61249 standar

Mechanical Data

 Case : SOT-323 Package

 Terminals : Solderable per MIL-STD-750, Method 2026

 Approx. Weight : 0.0002 ounces, 0.005 grams