FEATURES

• For surface mounted applications in order to optimize board space.

• Low profile package

• Built-in strain relief

• Glass passivated junction

• Excellent clamping capability

• Low inductance

• Fast response time: typically less than 1.0 ps from 0 volts to BV min

• Typical IR less than 1µA above 10V

• High temperature soldering : 250°C/10 seconds at terminals.

• Plastic package has Underwriters Laboratory Flammability Classification 94V-O