Features

Glasspassivatedchipjunction

Ideallysuitedforautomaticassembly

HighSurgeCurrentCapability

DesignedforSurfaceMountApplication

LeadfreeincompliancewithEURoHS2.0

GreenmoldingcompoundasperIEC61249standard

MechanicalData

Case:ABSPackage

Terminals:SolderableperMIL-STD-750,Method2026

Approx.Weight:0.0031ounces,0.088grams

Application

QuickCharger(<20W)

Generalpoweradapter(<30W)

In-doorLedlighting,Bulb/PARlighting

Netcompower(<35W)

Smartspeakeradapter(