TRANSFER-MOLD TYPE INSULATED TYPE

文件：182.95 Kbytes Page：9 Pages

TRANSFER-MOLD TYPE INSULATED TYPE

Generation DIP and Mini-DIP-IPM

Features: • Ultra Compact Transfer Mold Package • Including Drive and Protection ICs (low and high voltage drive ICs) • Low and High Speed Types • All Mitsubishi DIP and Mini-DIP-IPMs have lead-free terminals • From January 2006 onwards, all DIP and Mini-DIP-IPMs will be supplied with complet

Intellimod??Module Dual-In-Line Intelligent Power Module (5 Amperes/600 Volts)

Description: DIP and mini-DIP IPMs are intelligent power modules that integrate power devices, drivers, and protection circuitry in an ultra compact dual-in-line transfer-mold package for use in driving small three phase motors. Use of 4th generation IGBTs, DIP packaging, and application specific

3.3V DS21352 and 5V DS21552 T1 Single-Chip Transceivers

DESCRIPTION The DS21352/552 T1 single-chip transceiver contains all of the necessary functions for connection to T1 lines whether they are DS1 long haul or DSX–1 short haul. The clock recovery circuitry automatically adjusts to T1 lines from 0 feet to over 6000 feet in length. The device can gene

3.3V DS21352 and 5V DS21552 T1 Single-Chip Transceivers

DESCRIPTION The DS21352/552 T1 single-chip transceiver contains all of the necessary functions for connection to T1 lines whether they are DS1 long haul or DSX–1 short haul. The clock recovery circuitry automatically adjusts to T1 lines from 0 feet to over 6000 feet in length. The device can gene

3.3V DS21352 and 5V DS21552 T1 Single-Chip Transceivers

DESCRIPTION The DS21352/552 T1 single-chip transceiver contains all of the necessary functions for connection to T1 lines whether they are DS1 long haul or DSX–1 short haul. The clock recovery circuitry automatically adjusts to T1 lines from 0 feet to over 6000 feet in length. The device can gene