1 A low VF dual MEGA Schottky barrier rectifier

Features and benefits * Average forward current: IF(AV) ≤ 1 A * Reverse voltage: VR ≤ 60 V * Low forward voltage * Exposed heat sink (cathode pad) for excellent thermal and electrical conductivity * Leadless small SMD plastic package with medium power capability * AEC-Q101 qualified

1 A low VF dual MEGA Schottky barrier rectifier

60 V, 1 A low VF dual Schottky barrier rectifier

1. General description Planar Schottky barrier rectifier in common cathode configuration with an integrated guard ring for stress protection, encapsulated in a SOT1061 leadless small Surface-Mounted Device (SMD) plastic package with medium power capability. 2. Features and benefits • Averag

60 V, 1 A low VF dual Schottky barrier rectifier

1. General description Planar Schottky barrier rectifier in common cathode configuration with an integrated guard ring for stress protection, encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface- Mounted Device (SMD) plastic package with visible and solderable side pads.

封装/外壳：3-PowerUDFN 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：DIODE ARRAY SCHOTTKY 60V 3HUSON 分立半导体产品 二极管 - 整流器 - 阵列

60 V, 1 A low VF dual MEGA Schottky barrier rectifier

文件：713.16 Kbytes Page：15 Pages

60 V, 1 A low VF dual MEGA Schottky barrier rectifier

文件：231 Kbytes Page：15 Pages

封装/外壳：3-UDFN 裸露焊盘 包装：卷带（TR） 描述：DIODE SCHOTTKY 60V 1A DFN2020D-3 分立半导体产品 二极管 - 整流器 - 单

PLUGS AND JACKS

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US Power Supply Cord with IEC Connector C13, V-Lock, straight

Description - Power Cord, Protection class I, Pin temperature 70 °C, - with V-Lock interlocking system

THE BREAD BOARDING MEDIUM FOR SURFACE MOUNT

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US Power Supply Cord with IEC Connector C13, V-Lock, straight

Description - Power Cord, Protection class I, Pin temperature 70 °C, - with V-Lock interlocking system

IEC Interconnection Cord with IEC Connector C13, V-Lock, straight

文件：380.7 Kbytes Page：2 Pages