Chip Inductor

Features ■ Formerly a model ■ High resistance to heat and humidity ■ Resistance to mechanical shock and pressure ■ Accurate dimensions for automatic surface mounting ■ Inductance range: 1 to 150 μH ■ RoHS compliant* Applications ■ Mobile phones ■ Cellular phones ■ CTV, VCR, HIC, FD

Multilayer Ferrite Beads

FEATURES • High reliability • Surface mountable (multiple case sizes) • Magnetically self shielded • Nickel barrier plating virtually eliminates silver migration • Compliant to RoHS Directive 2011/65/EU • Halogen-free according to IEC 61249-2-21 definition

Wirewound, Surface-Mount Molded Inductors

FEATURES • Printed marking • Molded construction provides superior strength and moisture resistance • Compatible with vapor phase and infrared reflow soldering • Tape and reel packaging for automatic handling, 2000/reel, EIA-481 • Material categorization: for definitions of compliance ple

Wirewound, Surface-Mount, Molded, Shielded Inductors

FEATURES • Molded construction provides superior strength and moisture resistance • Tape and reel packaging for automatic handling, 2000/reel, EIA-481 • Compatible with vapor phase, infrared, and wave soldering methods • Shielded construction minimizes coupling to other components • Mater

NXP ARM® Cortex®-A8 i.MX53 RTX 1.6 Module

Features ƒƒ NXP ARM® Cortex®-A8 i.MX53 800MHz low power processor ƒƒ Onboard DDR3 memory 512MB, eMMC flash 4GB ƒƒ Dual channel 18/24 bit LVDS, 1920 x 1080P ƒƒ Rich I/O and touch interface support ƒƒ Power input 3.3~3.6V ƒƒ Low power consumption, fanless design ƒƒ Supports Linux and WinEC 7

N-Channel 20V (D-S) MOSFET

FEATURES • Halogen-free • TrenchFET® Power MOSFET • Optimized for High-Side Synchronous Rectifier Operation • 100 Rg Tested • 100 UIS Tested APPLICATIONS • Notebook CPU Core - High-Side Switch