ChipInductor

Features ■Formerlyamodel ■Highresistancetoheatandhumidity ■Resistancetomechanicalshockand pressure ■Accuratedimensionsforautomatic surfacemounting ■Inductancerange:1to150μH ■RoHScompliant* Applications ■Mobilephones ■Cellularphones ■CTV,VCR,HIC,FD

MultilayerFerriteBeads

FEATURES •Highreliability •Surfacemountable(multiplecasesizes) •Magneticallyselfshielded •Nickelbarrierplatingvirtuallyeliminatessilver migration •ComplianttoRoHSDirective2011/65/EU •Halogen-freeaccordingtoIEC61249-2-21definition

Wirewound,Surface-MountMoldedInductors

FEATURES •Printedmarking •Moldedconstructionprovidessuperiorstrength andmoistureresistance •Compatiblewithvaporphaseandinfraredreflow soldering •Tapeandreelpackagingforautomatichandling, 2000/reel,EIA-481 •Materialcategorization:fordefinitionsofcompliance ple

Wirewound,Surface-Mount,Molded,ShieldedInductors

FEATURES •Moldedconstructionprovidessuperiorstrength andmoistureresistance •Tapeandreelpackagingforautomatichandling, 2000/reel,EIA-481 •Compatiblewithvaporphase,infrared,and wavesolderingmethods •Shieldedconstructionminimizescouplingto othercomponents •Mater

NXPARM®Cortex®-A8i.MX53RTX1.6Module

Features ƒƒNXPARM®Cortex®-A8i.MX53800MHzlowpowerprocessor ƒƒOnboardDDR3memory512MB,eMMCflash4GB ƒƒDualchannel18/24bitLVDS,1920x1080P ƒƒRichI/Oandtouchinterfacesupport ƒƒPowerinput3.3~3.6V ƒƒLowpowerconsumption,fanlessdesign ƒƒSupportsLinuxandWinEC7