PCI Express to PCI Bridge

[PLX Technology, Inc.] Features ■ General Features o Forward and Reverse bridging o Tiny 161 ball BGA package (10mm x 10mm) o Low power – 0.3 Watts maximum o EEPROM configuration option with SPI o Internal 8Kbyte shared RAM o 1.5 V core supply voltage o JTAG

PCI Express to PCI Bridge

ExpressLane™ PCI Express to PCI Bridge Features General Features o Forward and Reverse bridging o 144-ball BGA package with standard 1.0 mm pitch (13mm x 13mm) o Alternative fine-pitch BGA package(10mm x 10mm) o Low power – 400 milliwatts o EEPROM configuration o

PCI Express to PCI Bridge

[PLX Technology, Inc.] Features ■ General Features o Forward and Reverse bridging o Tiny 161 ball BGA package (10mm x 10mm) o Low power – 0.3 Watts maximum o EEPROM configuration option with SPI o Internal 8Kbyte shared RAM o 1.5 V core supply voltage o JTAG

PCI Express to PCI Bridge

ExpressLane™ PCI Express to PCI Bridge Features General Features o Forward and Reverse bridging o 144-ball BGA package with standard 1.0 mm pitch (13mm x 13mm) o Alternative fine-pitch BGA package(10mm x 10mm) o Low power – 400 milliwatts o EEPROM configuration o

PCI Express to PCI Bridge

ExpressLane™ PCI Express to PCI Bridge Features General Features o Forward and Reverse bridging o 144-ball BGA package with standard 1.0 mm pitch (13mm x 13mm) o Alternative fine-pitch BGA package(10mm x 10mm) o Low power – 400 milliwatts o EEPROM configuration o

PCI Express to PCI Bridge

ExpressLane™ PCI Express to PCI Bridge Features General Features o Forward and Reverse bridging o 144-ball BGA package with standard 1.0 mm pitch (13mm x 13mm) o Alternative fine-pitch BGA package(10mm x 10mm) o Low power – 400 milliwatts o EEPROM configuration o

PCI Express to PCI Bridge

ExpressLane™ PCI Express to PCI Bridge Features General Features o Forward and Reverse bridging o 144-ball BGA package with standard 1.0 mm pitch (13mm x 13mm) o Alternative fine-pitch BGA package(10mm x 10mm) o Low power – 400 milliwatts o EEPROM configuration o

PCI Express to PCI Bridge

[PLX Technology, Inc.] Features ■ General Features o Forward and Reverse bridging o Tiny 161 ball BGA package (10mm x 10mm) o Low power – 0.3 Watts maximum o EEPROM configuration option with SPI o Internal 8Kbyte shared RAM o 1.5 V core supply voltage o JTAG

PCI Express to PCI Bridge

ExpressLane™ PCI Express to PCI Bridge Features General Features o Forward and Reverse bridging o 144-ball BGA package with standard 1.0 mm pitch (13mm x 13mm) o Alternative fine-pitch BGA package(10mm x 10mm) o Low power – 400 milliwatts o EEPROM configuration o

PCI Express to PCI Bridge

ExpressLane™ PCI Express to PCI Bridge Features General Features o Forward and Reverse bridging o 144-ball BGA package with standard 1.0 mm pitch (13mm x 13mm) o Alternative fine-pitch BGA package(10mm x 10mm) o Low power – 400 milliwatts o EEPROM configuration o

PCI Express to PCI Bridge

[PLX Technology, Inc.] Features ■ General Features o Forward and Reverse bridging o Tiny 161 ball BGA package (10mm x 10mm) o Low power – 0.3 Watts maximum o EEPROM configuration option with SPI o Internal 8Kbyte shared RAM o 1.5 V core supply voltage o JTAG

ExpressLane™ PCI Express to PCI Bridge

260 MHz, 16 x 8 Buffered Video Crosspoint Switches

PRODUCT DESCRIPTION The AD8110 and AD8111 are high speed 16 × 8 video cross-point switch matrices. They offer a –3 dB signal bandwidth greater than 260 MHz, and channel switch times of less than 25 ns with 1 settling. With –78 dB of crosstalk and –97 dB isolation (@ 5 MHz), the AD8110/AD8111 are

8mm VTR Sensor Amplifier

Overview The LB8111V is equipped with built-in amplifiers for use with reel FG, drum FG and drum PG applications to make this IC most suitable for portable VCR (Video Cassette Recorder) applications. Features • Built-in 2-channel reed FG amplifier. • Built-in drum FG amplifier. • Built-i

8mm VTR Sensor Amplifier

Overview The LB8111V is equipped with built-in amplifiers for use with reel FG, drum FG and drum PG applications to make this IC most suitable for portable VCR (Video Cassette Recorder) applications. Features • Built-in 2-channel reed FG amplifier. • Built-in drum FG amplifier. • Built-i

6-Pin DIP Optoisolators Transistor Output(No Base Connection)

6-Pin DIP Optoisolators Transistor Output(No Base Connection) The MOC8111, MOC8112 and MOC8113 devices consist of a gallium arsenide infrared emitting diode optically coupled to a monolithic silicon phototransistor detector. The internal base–to–Pin 6 connection has been eliminated for improved n

PHOTOTRANSISTOR OPTOCOUPLERS

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