PCI Express to PCI Bridge

[PLX Technology, Inc.] Features ■ General Features o Forward and Reverse bridging o Tiny 161 ball BGA package (10mm x 10mm) o Low power – 0.3 Watts maximum o EEPROM configuration option with SPI o Internal 8Kbyte shared RAM o 1.5 V core supply voltage o JTAG

PCI Express to PCI Bridge

ExpressLane™ PCI Express to PCI Bridge Features General Features o Forward and Reverse bridging o 144-ball BGA package with standard 1.0 mm pitch (13mm x 13mm) o Alternative fine-pitch BGA package(10mm x 10mm) o Low power – 400 milliwatts o EEPROM configuration o

PCI Express to PCI Bridge

[PLX Technology, Inc.] Features ■ General Features o Forward and Reverse bridging o Tiny 161 ball BGA package (10mm x 10mm) o Low power – 0.3 Watts maximum o EEPROM configuration option with SPI o Internal 8Kbyte shared RAM o 1.5 V core supply voltage o JTAG

PCI Express to PCI Bridge

ExpressLane™ PCI Express to PCI Bridge Features General Features o Forward and Reverse bridging o 144-ball BGA package with standard 1.0 mm pitch (13mm x 13mm) o Alternative fine-pitch BGA package(10mm x 10mm) o Low power – 400 milliwatts o EEPROM configuration o

PCI Express to PCI Bridge

ExpressLane™ PCI Express to PCI Bridge Features General Features o Forward and Reverse bridging o 144-ball BGA package with standard 1.0 mm pitch (13mm x 13mm) o Alternative fine-pitch BGA package(10mm x 10mm) o Low power – 400 milliwatts o EEPROM configuration o

PCI Express to PCI Bridge

ExpressLane™ PCI Express to PCI Bridge Features General Features o Forward and Reverse bridging o 144-ball BGA package with standard 1.0 mm pitch (13mm x 13mm) o Alternative fine-pitch BGA package(10mm x 10mm) o Low power – 400 milliwatts o EEPROM configuration o

PCI Express to PCI Bridge

ExpressLane™ PCI Express to PCI Bridge Features General Features o Forward and Reverse bridging o 144-ball BGA package with standard 1.0 mm pitch (13mm x 13mm) o Alternative fine-pitch BGA package(10mm x 10mm) o Low power – 400 milliwatts o EEPROM configuration o

PCI Express to PCI Bridge

[PLX Technology, Inc.] Features ■ General Features o Forward and Reverse bridging o Tiny 161 ball BGA package (10mm x 10mm) o Low power – 0.3 Watts maximum o EEPROM configuration option with SPI o Internal 8Kbyte shared RAM o 1.5 V core supply voltage o JTAG

PCI Express to PCI Bridge

ExpressLane™ PCI Express to PCI Bridge Features General Features o Forward and Reverse bridging o 144-ball BGA package with standard 1.0 mm pitch (13mm x 13mm) o Alternative fine-pitch BGA package(10mm x 10mm) o Low power – 400 milliwatts o EEPROM configuration o

PCI Express to PCI Bridge

ExpressLane™ PCI Express to PCI Bridge Features General Features o Forward and Reverse bridging o 144-ball BGA package with standard 1.0 mm pitch (13mm x 13mm) o Alternative fine-pitch BGA package(10mm x 10mm) o Low power – 400 milliwatts o EEPROM configuration o

PCI Express to PCI Bridge

[PLX Technology, Inc.] Features ■ General Features o Forward and Reverse bridging o Tiny 161 ball BGA package (10mm x 10mm) o Low power – 0.3 Watts maximum o EEPROM configuration option with SPI o Internal 8Kbyte shared RAM o 1.5 V core supply voltage o JTAG

ExpressLane™ PCI Express to PCI Bridge

Vibrating filling level switch

The Type 8111 is a filling level switch for liquids, using a tuning fork as the sensor element. It is designed for industrial use in all areas of process technology and can be used in liquids. Typical applications are overfill or dry run protection. Depending on the version, the devices are al

T-1 Subminiature Lamps

T-1 Subminiature Lamps T-1 Subminiature Short Type Lamps

IEC Connector C15, Rewireable, Angled

文件：473.98 Kbytes Page：3 Pages

IEC Connector C15, Rewireable, Angled

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PEN RECORDER

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