50 V, 100 mA PNP resistor-equipped transistors

Features and benefits • 100 mA output current capability • Built-in resistors • Simplifies circuit design • Reduces component count • Reduces pick and place costs • Low package height of 0.5 mm • Suitable for Automatic Optical Inspection (AOI) of solder joint

50 V, 100 mA NPN resistor-equipped transistors

Features and benefits • 100 mA output current capability • Built-in resistors • Simplifies circuit design • Reduces component count • Reduces pick and place costs • Low package height of 0.5 mm • Suitable for Automatic Optical Inspection (AOI) of solder joint

50 V, 100 mA PNP resistor-equipped transistors

50 V, 100 mA NPN resistor-equipped transistors

Features and benefits • 100 mA output current capability • Built-in resistors • Simplifies circuit design • Reduces component count • Reduces pick and place costs • Low package height of 0.5 mm • Suitable for Automatic Optical Inspection (AOI) of solder joint • Qualified according to AEC-Q

50 V, 100 mA PNP resistor-equipped transistors

1. General description 100 mA PNP Resistor-Equipped Transistor (RET) family in an ultra small DFN1412D-3 (SOT8009) leadless Surface-Mounted Device (SMD) plastic package with side-wettable flanks. Table 1. Product overview Type number R1 R2 Package kΩ kΩ Nexperia JEDEC NPN complement: PDTA14

50 V, 100 mA PNP resistor-equipped transistors

1. General description 100 mA PNP Resistor-Equipped Transistor (RET) family in an ultra small DFN1412D-3 (SOT8009) leadless Surface-Mounted Device (SMD) plastic package with side-wettable flanks. 2. Features and benefits • 100 mA output current capability • Built-in resistors • Simplifies

50 V, 100 mA PNP resistor-equipped transistors

1. General description 100 mA PNP Resistor-Equipped Transistor (RET) family in an ultra small DFN1412D-3 (SOT8009) leadless Surface-Mounted Device (SMD) plastic package with side-wettable flanks. 2. Features and benefits • 100 mA output current capability • Built-in resistors • Simplifies

50 V, 100 mA PNP resistor-equipped transistors

封装/外壳：3-XDFN 裸露焊盘 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：PDTA144EQC-Q/SOT8009/DFN1412D- 分立半导体产品 晶体管 - 双极（BJT）- 单，预偏置

封装/外壳：3-XDFN 裸露焊盘 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：PDTA144EQC/SOT8009/DFN1412D-3 分立半导体产品 晶体管 - 双极（BJT）- 单，预偏置

PGA ZIF Test & Burn-in Socket for Any Footprint on Std 8x8 to 21x21 Grid

FEATURES • Strong Metal Cam Activates Normally-closed Contacts, Preventing Dependency on Plastic for Contact Force • Handle mounted on Right- or Left-hand Side • Any Footprint Accepted on Standard 13x13 to 21x21 Grid GENERAL SPECIFICATIONS • SOCKET BODY: black UL 94V-0 Polyphenylene Sulfid

LOW PROFILE - P.C. BOARD MOUNT AUDIO TRANSFORMERS

文件：376.28 Kbytes Page：2 Pages

LOW PROFILE - P.C. BOARD MOUNT AUDIO TRANSFORMERS

文件：376.28 Kbytes Page：2 Pages

LOW PROFILE - P.C. BOARD MOUNT AUDIO TRANSFORMERS

文件：376.28 Kbytes Page：2 Pages

LOW PROFILE - P.C. BOARD MOUNT AUDIO TRANSFORMERS

文件：376.28 Kbytes Page：2 Pages