TABLE 4 GROUP A INSPECTION

* These components are used to stabilize device due to poor high frequency characteristics of burn in board. ** Input signals are calculated to result in internal power dissipation of approximately 2.1W at case temperature = 125°C.

Table 4 Group A Inspection

* These components are used to stabilize device due to poor high frequency characteristics of burn in board. ** Input signals are calculated to result in internal power dissipation of approximately 2.1W at case temperature = 125°C.

Table 4 Group A Inspection

Table 4 Group A Inspection

* These components are used to stabilize device due to poor high frequency characteristics of burn in board. ** Input signals are calculated to result in internal power dissipation of approximately 2.1W at case temperature = 125°C.

Table 4 Group A Inspection

* These components are used to stabilize device due to poor high frequency characteristics of burn in board. ** Input signals are calculated to result in internal power dissipation of approximately 2.1W at case temperature = 125°C.