包装：散装 描述：TSSOP-38 TO DIP-38 SMT ADAPTER 原型开发，制造品 适配器，分接板

包装：散装 描述：TSSOP-38 STENCIL 焊接，拆焊，返修产品 焊接模版，模板

Edge Intelligence System with Intel 11th generation with Edge X API and WISE-DeviceOn

Features ƒ Intel 11th gen. Core i5/i3/Celeron ƒ Pre-integrated Edge X with data acquisition API ƒ Pre-integrated WISE-DeviceOn for device management and remote control ƒ 8/16 GB DDR4 Memory Built-in ƒ 64 GB SATA Slim SSD Built-in ƒ Compact 156 x 112 x 60mm dimensions ƒ 4K HDMI and DP 1.4a D

Reflectors, Fibers, Optics

BFO 18A-XAE-SMG-30-2 Basic features Basic standard IEC 60947-5-2 Reference base unit BFB M18M-011-P-S4 Scope of delivery Fiber optics Version Ø 6, 90° optics

Inductive Sensors

BES 516-300-S289-BO-D-PU-05 Basic features Approval/Conformity CE UKCA cULus WEEE Basic standard IEC 60947-5-2

Inductive Sensors

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LF (125 kHz)

文件：105.25 Kbytes Page：2 Pages