Features

● 1/2.7”

● 1600x1400

● 8/10/12-bit

● 2.79 μm

90 fps global shutter with CDS

High sensitivity

Small die size achieved via state-of-the-art stacked

BSI technology

Class leading QE at 940 nm combined with high

sensitivity. Industry leading PLS at 940 nm

Digital CDS and row noise correction

● On chip defect pixel detection and correction

● On chip image statistics generation

Available as Mono, RGB or RGBIR variant.

Orderable with AR coated or plain glass and

protective film

Low power consumption