Features

• package: standard SMT footprint 0603, colorless diffused resin

• feature of the device: smallest package 1.7 x 0.8 x 0.65 mm (LxWxH); more light due to higher optical efficiency

• wavelength: 470 nm (blue)

• viewing angle: 150°

• technology: ThinGaN®

• optical efficiency: 7 lm/W

• grouping parameter: luminous intensity, wavelength, forward voltage

• assembly methods: suitable for all SMT assembly methods

• soldering methods: IR reflow soldering and TTW soldering

• preconditioning: acc. to JEDEC Level 2

• taping: 8 mm tape with 5000/reel, ø180 mm

• ESD-withstand voltage: ESD sensitive device

Applications

• flat backlighting (LCD, cellular phones, switches, displays)

• toys

• signal and symbol luminary

• marker lights (e.g. steps, exit ways, etc.)