Features:

 package 1206

 size 1206: 3.2(L) x 1.6(W) x 1.2(H) mm

 circuit substrate: glass laminated epoxy

 devices are ROHS and REACH conform

 lead free solderable, soldering pads: gold

plated

 taped in 8 mm blister tape, cathode to

transporting perforation

 all devices sorted into luminous intensity

classes

 taping: face-up (T) or face-down (TD) possible