Description

The OP950 device consists of a PIN silicon photodiode molded in a clear epoxy package which allows spectral response from visible to infrared light wavelengths. The wide receiving angle provides relatively even reception over a large area. The side-looking package is designed for easy PC board mounting. This photodiode is mechanically and spectrally matched to Optek’s GaAs and GaAlAs series of infrared emitting diodes.

Features

·Wide receiving angle

·Linear response vs. irradiance

·Fast switching time

·Side-looking package ideal for space limited applications

Absolute Maximum Ratings (TA = 25℃ unless other wise noted)

Reverse Breakdown Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 V

Storage and Operating Temperature Range . . . . . . . . . . . . . . . . . . -40℃ to +100℃

Lead Solder ing Temperature [1/16 inch (1.6 mm) from case for 5 sec. with soldering iron]. . . . . . . . . . . . . . . . . . . 260℃

Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mW