位置:TND306 > TND306详情
TND306中文资料
TND306数据手册规格书PDF详情
HC vs. HCT
ON Semiconductor’s High–Speed CMOS product family, intended to give the designer an alternative to LSTTL. HSCMOS, with the faster speed advantage over metal–gate CMOS (MC14000 series) and the lower power consumption advantage over LSTTL, is an optimum choice for midrange designs. With the availability of high–speed CMOS microprocessors and memories, the ability to design a 100 CMOS system is possible.
HCT devices offer a short–term solution to the TTL/NMOS–to–CMOS interface problem. To achieve this interface capability, some CMOS advantages had to be compromised. These compromises include power consumption, operating voltage range, and noise immunity.
In most cases HCT devices are drop–in replacements of TTL devices with significant advantages over the TTL devices. However, in some cases, an equivalent HCT device may not replace a TTL device without some form of circuit modification.
Designers can use HCT devices to perform logic level conversions only. In newer designs, the designer wants all the advantages of a true CMOS system and designs using only HC devices.
TND306产品属性
- 类型
描述
- 型号
TND306
- 制造商
ONSEMI
- 制造商全称
ON Semiconductor
- 功能描述
High-Speed CMOS Product Designation Definitions
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
onsemi |
25+ |
N/A |
20948 |
样件支持,可原厂排单订货! |
|||
onsemi |
25+ |
N/A |
21000 |
正规渠道,免费送样。支持账期,BOM一站式配齐 |
|||
onsemi(安森美) |
25+ |
- |
10000 |
现货 |
|||
SANYO/三洋 |
24+ |
MSOP8 |
12000 |
原装正品 假一罚十 可拆样 |
|||
SANYO/三洋 |
2026+ |
MSOP8 |
54648 |
百分百原装现货 实单必成 欢迎询价 |
|||
Rochester |
25+ |
电联咨询 |
7800 |
公司现货,提供拆样技术支持 |
|||
SANYO |
24+ |
MSOP8 |
25836 |
新到现货,只做全新原装正品 |
|||
SANYO(三洋半导体) |
25+ |
封装 |
500000 |
源自原厂成本,高价回收工厂呆滞 |
|||
ON Semiconductor |
24+ |
/ |
3000 |
全新、原装 |
|||
SANYO/三洋 |
26+ |
MSOP8 |
12000 |
原装,正品 |
TND306 资料下载更多...
TND306 芯片相关型号
- 83A3B-A20-K08
- APHHS1005PBC-A
- APHHS1005SECK
- APHHS1005SYCK_07
- M3H12FCG-R
- M3H27FCG-R
- M3H41FCG-R
- MC100EPT20
- MC68HC711E20CFU2
- MC68HC711E20VFU2
- MC68HC811E2MP2
- MC9S08GB60CFB
- MC9S08GT32CB
- MC9S08GT32CFB
- MC9S12KC128CPV
- MC9S12KC64MPV
- MC9S12KG256VPV
- MC9S12KL64CPV
- MC9S12KT256CPU
- MC9S12KT256VPU
- T2800D
- T2800D_06
- TND301
- TZT4G55
- XC6103B629
- XC6107B629
- XC6111B629
- XC6113B629
- XC6114B629
- XC6117B629
ONSEMI相关芯片制造商
Datasheet数据表PDF页码索引
- P1
- P2
- P3
- P4
- P5
- P6
- P7
- P8
- P9
- P10
- P11
- P12
- P13
- P14
- P15
- P16
- P17
- P18
- P19
- P20
- P21
- P22
- P23
- P24
- P25
- P26
- P27
- P28
- P29
- P30
- P31
- P32
- P33
- P34
- P35
- P36
- P37
- P38
- P39
- P40
- P41
- P42
- P43
- P44
- P45
- P46
- P47
- P48
- P49
- P50
- P51
- P52
- P53
- P54
- P55
- P56
- P57
- P58
- P59
- P60
- P61
- P62
- P63
- P64
- P65
- P66
- P67
- P68
- P69
- P70
- P71
- P72
- P73
- P74
- P75
- P76
- P77
- P78
- P79
- P80
- P81
- P82
- P83
- P84
- P85
- P86
- P87
- P88
- P89
- P90
- P91
- P92
- P93
- P94
- P95
- P96
- P97
- P98
- P99
- P100
- P101
- P102
- P103
- P104
- P105
- P106
- P107
- P108
