Features

• Advanced Dual−sided Cooled Packaging

• Small Footprint (5x6 mm) for Compact Design

• Ulra Low RDS(on) to Minimize Conduction Losses

• Low QG and Capacitance to Minimize Driver Losses

• AEC−Q101 Qualified and PPAP Capable

• These Devices are Pb−Free and are RoHS Compliant

• MSL1 Robust Packaging Design