Features

• Advanced Source−Down Package Technology (3.3x3.3mm) with

Excellent Thermal Conduction

• Ultra Low RDS(on) to Improve System Efficiency

• Low QG and Capacitance to Minimize Driving and Switching Losses

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

Typical Applications

• DC−DC Switching Applications

• ORing Applications

• Power Load Switch

• Battery Management and Protection