Features

• Fine Lithography Trench−based Schottky Technology for Very Low

Forward Voltage and Low Leakage

• Fast Switching with Exceptional Temperature Stability

• Low Power Loss and Lower Operating Temperature

• Higher Efficiency for Achieving Regulatory Compliance

• High Surge Capability

• These are Pb−Free and Halide−Free Devices

Typical Applications

• Switching Power Supplies including Wireless, Smartphone and

Notebook Adapters

• High Frequency and DC−DC Converters

• Freewheeling and OR−ing diodes

• Reverse Battery Protection

• Instrumentation

• LED Lighting

Mechanical Characteristics:

• Case: Epoxy, Molded

• Epoxy Meets Flammability Rating UL 94−0 @ 0.125 in.

• Lead Finish: 100 Matte Sn (Tin)

• Lead and Mounting Surface Temperature for Soldering Purposes:

260°C Max. for 10 Seconds

• Device Meets MSL 1 Requirements